? semiconductor components industries, llc, 2012 august, 2012 ? rev . 10 1 publication order number: mbrb20100ct/d mbrb20100ctg, nr vbb20100ctt4g, nr vbbs20100ctt4g switchmode power rectifier d 2 p a k surface mount power package the d 2 p ak power rectifier is a state ? of ? the ? art device that employs the use of the schottky barrier principle with a platinum barrier metal. features ? package designed for power surface mount applications ? center ? t ap configuration ? guardring for stress protection ? low forward v oltage ? 175 c operating junction t emperature ? epoxy meets ul 94 v ? 0 @ 0.125 in ? short heat sink t ab manufactured ? not sheared! ? similar in size to industry standard t o ? 220 package ? nr vbb and nr vbbs prefixes for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and pp ap capable ? these devices are pb ? free and are rohs compliant* mechanical characteristics ? case: epoxy , molded, epoxy meets ul 94 v ? 0 ? w eight: 1.4 grams (approximately) ? finish: all external surfaces corrosion resistant and t erminal leads are readily solderable ? lead and mounting surface t emperature for soldering purposes: 260 c max. for 10 seconds ? mbrb20100ctg, nr vbb20100ctt4g meets msl1 requirements ? nr vbbs20100ctt4g meets msl2 requirements ? esd ratings: ? machine model = c (> 400 v) ? human body model = 3b (> 8000 v) *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. d 2 pak case 418b style 3 schottky barrier rectifier 20 amperes 100 volts 1 3 4 marking diagram http://onsemi.com a y ww b20100g aka s e e detailed ordering and shipping information in the package dimensions section on p age 2 of this data sheet. ordering informa tion a = assembly location y = y ear ww = w ork w eek b20100 = device code g = pb ? free package aka = diode polarity http://
mbrb20100ctg, nrvbb20100ctt4g, NRVBBS20100CTT4G http://onsemi.com 2 maximum ra tings (per leg) rating symbol value unit peak repetitive reverse v oltage w orking peak reverse v oltage dc blocking voltage v rrm v rw m v r 100 v a verage rectified forward current per leg (rated v r , t c = 155 c) total device i f(av) 10 20 a peak repetitive forward current (rated v r , square wave, 20 khz, t c = 150 c) i frm 20 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 150 a peak repetitive reverse surge current (2.0 s, 1.0 khz) i rrm 0.5 a storage temperature range t stg ? 65 to +175 c operating junction temperature (note 1) t j ? 65 to +175 c voltage rate of change (rated v r ) dv/dt 10,000 v/ s stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only . functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability . 1. the heat generated must be less than the thermal conductivity from junction ? to ? ambient: dp d /dt j < 1/r ja . thermal characteristics (per leg) characteristic symbol value unit thermal resistance, junction ? to ? case junction ? to ? ambient (note 2) r jc r ja 2.0 50 c/w 2. when mounted using minimum recommended pad size on fr ? 4 board. electrical characteristics (per leg) characteristic symbol value unit maximum instantaneous forward v o ltage (note 3) (i f = 10 amp, t c = 125 c) (i f = 10 amp, t c = 25 c) (i f = 20 amp, t c = 125 c) (i f = 20 amp, t c = 25 c) v f 0.75 0.85 0.85 0.95 v maximum instantaneous reverse current (note 3) (rated dc v oltage, t j = 125 c) (rated dc voltage, t j = 25 c) i r 6.0 0.1 ma 3. pulse t e st: pulse width = 300 s, duty cycle 2.0%. ordering informa tion device package shipping ? mbrb20100ctg d 2 pak (pb ? free) 50 units / rail mbrb20100ctt4g d 2 pak (pb ? free) 800 units / tape & reel nrvbb20100ctt4g d 2 pak (pb ? free) 800 units / tape & reel NRVBBS20100CTT4G d 2 pak (pb ? free) 800 units / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mbrb20100ctg, nrvbb20100ctt4g, NRVBBS20100CTT4G http://onsemi.com 3 figure 1. t ypical forward v oltage per diode figure 2. t ypical reverse current per diode figure 3. t ypical current derating, case, per leg 0.5 0 v f , instantaneous voltage (volts) 1 3 5 10 20 50 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 i f , inst ant aneous for w ard current (amps) t j = 25 c 100 c 150 c 125 c 0 a verage current (amps) 0 2 4 6 8 10 12 14 16 18 20 2 4 6 8 10 12 14 16 18 20 a verage power (w a tts) t j = 125 c dc i pk /i av = 10 i pk /i av = 20 pi i pk /i av = 5 square wave figure 4. average power dissipation & average current 80 t c , case tempera ture ( c) 15 0 i 100 120 140 160 , a verage for w ard current (amps) f(a v) square wa ve dc 10 20 ra ted vol t age applied r jc = 2 c/w 180 5.0 v r , reverse vol t age (vol ts) 0 i 20 40 60 80 0.1 1.0 , reverse current (ma) r 10 t j = 150 c 125 c 100 c 0.01 25 c 100 0.0001 0.001
mbrb20100ctg, nrvbb20100ctt4g, NRVBBS20100CTT4G http://onsemi.com 4 p ackage dimensions d 2 pa k case 418b ? 04 issue k style 3: pin 1. anode 2. ca thode 3. anode 4. cathode sea ting plane s g d ? t ? m 0.13 (0.005) t 23 1 4 3 pl k j h v e c a dim min max min max millimeters inches a 0.340 0.380 8.64 9.65 b 0.380 0.405 9.65 10.29 c 0.160 0.190 4.06 4.83 d 0.020 0.035 0.51 0.89 e 0.045 0.055 1.14 1.40 g 0.100 bsc 2.54 bsc h 0.080 0.1 10 2.03 2.79 j 0.018 0.025 0.46 0.64 k 0.090 0.1 10 2.29 2.79 s 0.575 0.625 14.60 15.88 v 0.045 0.055 1.14 1.40 ? b ? m b w w notes: 1. dimensioning and t olerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 418b ? 01 thru 418b ? 03 obsolete, new standard 418b ? 04. f 0.310 0.350 7.87 8.89 l 0.052 0.072 1.32 1.83 m 0.280 0.320 7.11 8.13 n 0.197 ref 5.00 ref p 0.079 ref 2.00 ref r 0.039 ref 0.99 ref m l f m l f m l f variable configuration zone r n p u view w ? w view w ? w view w ? w 12 3 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 8.38 5.080 dimensions: millimeters pitch 2x 16.155 1.016 2x 10.49 3.504
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